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    Intel Faces Potential Breakup as Broadcom, TSMC Eye Key Divisions

    San Francisco, February 17, 2025 — Broadcom and Taiwan Semiconductor Manufacturing Co. (TSMC) are reportedly in talks to restructure Intel by acquiring different parts of the company. Broadcom is looking at Intel’s chip design and marketing divisions, while TSMC is interested in its semiconductor fabrication plants. These discussions are still in the early stages.

    Intel has faced significant setbacks, including a drop in market value and challenges in its foundry business. It has also struggled to keep up with AI advancements, which led to the dismissal of CEO Pat Gelsinger in 2024. Any restructuring plans would need approval from the U.S. government due to concerns over foreign ownership of critical manufacturing assets.

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